Effect of small amounts of chalcogen alloying elements on the oxidation resistance of copper
Author:
Zhu Yongfu1, Wang Yaru1, Zhang Jian1, Li Chunhe1, Ji Zhengtong1, Liu Guojun1ORCID
Affiliation:
1. School of Materials Science and Engineering , Key Laboratory of Automobile Materials, Ministry of Education, Jilin University , Changchun 130022 , China
Abstract
Abstract
The effect of small amounts of chalcogen alloying elements (S, Se and Te) on the oxidation resistance (OR) of Cu has been investigated at 300–800 °C in 0.1 MPa oxygen atmospheres. Compared to pure copper, the addition of S, Se and Te could effectively improve the OR below 600 °C mainly owing to the chalcogen-element inclusions which hinder the diffusion of Cu. However, it becomes weak above 800 °C. In contrast, the failure at 800 °C is associated with the absence of those inclusions. The results are discussed in detail by the thermodynamic methods.
Funder
Key Scientific and Technological Research and Development Project of Jilin Province National Natural Science Foundation of China
Publisher
Walter de Gruyter GmbH
Subject
General Materials Science,General Chemical Engineering,General Chemistry
Reference30 articles.
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