Rheological and Calorimetric Characterization of an Epoxy System Cured in Presence of a Reactive Polyethersulphone
Author:
Publisher
Walter de Gruyter GmbH
Subject
Materials Chemistry,Polymers and Plastics,General Chemical Engineering
Link
https://www.degruyter.com/document/doi/10.1515/POLYENG.2000.20.3.159/pdf
Reference9 articles.
1. Chemorheology of thermosetting resins. I. The chemorheology and curing kinetics of unsaturated polyester resin
2. Epoxy thermosetting systems: Dynamic mechanical analysis of the reactions of aromatic diamines with the diglycidyl ether of bisphenol A
3. Relationship between viscoelastic properties and gelation in thermosetting systems
4. Rheology of epoxy networks near the gel point
5. Temperature Dependence of the Behavior of a Reactive Epoxy−Amine System by Means of Dynamic Rheology. 2. High-Tg Epoxy−Amine System
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