Effect of bonding temperature on microstructure and properties of TLP joined Q355 steel with Cu interlayer

Author:

Huang Bensheng1ORCID,Tang Peng1,Ju Chunyan2,Chen Peng1,Shen Wenzhu1,Zuo Hanyang3

Affiliation:

1. School of New Energy and Materials , Southwest Petroleum University , Chengdu , China

2. Jingfeng Mingyuan , Chengdu , China

3. Sichuan University of Science and Engineering , Zigong , Sichuan , China

Abstract

Abstract Q355 steel with Cu interlayer was bonded by transient liquid phase diffusion bonding (TLP-DB) at different bonding temperatures, and good bonding joints were obtained. The joints were characterized by optical microscopy, scanning electron microscopy and mechanical properties. The results show that there is a bending phenomenon caused by the difference of element diffusion at the bonding interface at the bonding temperature of 1050 °C. With the increase of the bonding temperature, the diffusion of Cu element plays a role in refining the grain, but with the increase of the bonding temperature, it will also lead to the overgrowth of the grain; At the bonding temperature of 1050 °C, there are obvious mutations in the diffusion of Cu and Fe elements, but the increase of the bonding temperature has a good effect on the interdiffusion of the elements. The mechanical properties test showed that with the increase of the bonding temperature, the hardness, shear strength, and impact toughness at the center of the joint increased first and then decreased, and all reached the maximum at 1100 °C. The electrochemical performance test showed that with the increase of temperature, the corrosion resistance of the joint also increased first and then decreased.

Funder

The School of New Energy and Materials

The Opening Project of Material Corrosion and Protection Key Laboratory of Sichuan province

The Sichuan Provincial Engineering Research Center of Advanced Materials Manufacturing Technology for Shale Gas High-efficient Exploitation

Publisher

Walter de Gruyter GmbH

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

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