Interfacial reaction between Cu and Ti2SnC during processing of Cu–Ti2SnC composite

Abstract

Abstract Interfacial reaction between Cu and Ti2SnC during the processing of Cu–Ti2SnC composite was investigated by using X-ray diffraction, scanning electron microscopy, and transmission electron microscopy. It is shown that the reaction is closely related to the reaction temperature, reaction time, and relative ratio of Cu and Ti2SnC. The reacting products are Cu(Sn) solid solution and TiC x , and the transporting process during interfacial reaction is described. The interfacial reaction products are further confirmed by measuring the hardness across the interface using nanoindentation test. It is shown that the reaction is controlled by the de-intercalation of Sn from Ti2SnC to form Cu(Sn) solid solution and TiC x , and crystallographic relations of [01̅1] TiC x // [010] Ti2SnC and (11̅1̅) TiC x // (001) Ti2SnC were observed at the interface. The effect of interfacial reaction on the mechanical and electrical properties of the composite is also discussed.