A fast and simple bonding method for low cost microfluidic chip fabrication-Reference-Cited by-同舟云学术

A fast and simple bonding method for low cost microfluidic chip fabrication

Published:2018-01-01 Issue:1 Volume:69 Page:72-78
ISSN:1339-309X
Container-title:Journal of Electrical Engineering
language:en
Short-container-title:

Author:

Yin Zhifu¹,Zou Helin²

Affiliation:

1. School of Mechanical Science and Engineering , Jilin University , Changchun 130012 , China

2. Key Laboratory for Micro/Nano Technology and Systems of Liaoning Province , Dalian University of Technology , Dalian 116024 , China

Abstract

Abstract With the development of the microstructure fabrication technique, microfluidic chips are widely used in biological and medical researchers. Future advances in their commercial applications depend on the mass bonding of microfluidic chip. In this study we are presenting a simple, low cost and fast way of bonding microfluidic chips at room temperature. The influence of the bonding pressure on the deformation of the microchannel and adhesive tape was analyzed by numerical simulation. By this method, the microfluidic chip can be fully sealed at low temperature and pressure without using any equipment. The dye water and gas leakage test indicated that the microfluidic chip can be bonded without leakage or block and its bonding strength can up to 0.84 MPa.

Publisher

Walter de Gruyter GmbH

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