Development of Crack Detection Method with 2 Dimensionally Generated 3 Dimensionally Reconstructed Images in THT Solder Joints

Author:

Gergely G.,Koncz-Horváth D.,Weltsch Z.,Gácsi Z.

Abstract

AbstractThis work represents an interesting development in the detection and interpretation of crack evolution in through hole technology (THT) solder joints, which based on the development of general and common method. Serial sectioning is a useful method because it overcomes the problems associated with traditional two-dimensional metallographic techniques by providing information about (micro)structures in three-dimensions.In our work, serials sectioning with reconstruction method was utilized to visualize the 3D nature of cracks in through hole solder joint. Accurate quantitive analysis of the cracks, such as crack length, position and extension are presented with a help of the developed method: newly defined parameter and serial-cross sectioning method.

Publisher

Walter de Gruyter GmbH

Subject

Metals and Alloys

Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

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3. Optimize the joining technology of CFRP and aluminium sheets using hybrid and high strength adhesive;IOP Conference Series: Materials Science and Engineering;2018-11-29

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