Affiliation:
1. Laserinstitut Hochschule Mittweida , University of Applied Sciences Mittweida , Mittweida , Germany
Subject
Instrumentation,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference21 articles.
1. S. Kim, B. S. Bang, F. Ren, et al.., “High-rate laser ablation for through-wafer via holes in SiC substrates and GaN/AIN/SiC,” J. Semicond. Technol. Sci., vol. 4, pp. 217–221, 2004.
2. H. Exner, L. Hartwig, R. Ebert, et al.., “High speed laser micro processing using high brilliance continuous wave laser radiation,” JLMN, vol. 7, pp. 115–121, 2012. https://doi.org/10.2961/jlmn.2012.01.0023.
3. U. Loeschner, J. Schille, A. Streek, et al.., “High-rate laser micro processing using a polygon scanner system,” J. Laser Appl., vol. 27, p. S29303, 2015, https://doi.org/10.2351/1.4906473.
4. J. Schille, L. Schneider, S. Mauersberger, et al.., “High-rate laser surface texturing for advanced tribological functionality,” Lubricants, vol. 8, p. 33, 2020, https://doi.org/10.3390/lubricants8030033.
5. Fraunhofer Cluster of excellence Advanced Photon Sources (CAPS). Available at: www.caps.fraunhofer.de [accessed: Oct. 18, 2021].
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