Applying metal coatings to dielectric materials by photochemical processes

Abstract

Abstract Photochemical processes in thin surface layers of solutions of compounds of the copper subgroup elements leading to the formation of dispersed metal particles on the surface of dielectrics are investigated. It is shown that dispersed particles of elemental gold are formed on dielectrics moistened with AuCl3 solution and exposed to sunlight. At the same time, there is no need to use any chemical reducing agents. On cotton fabrics moistened with solutions of AgNO3, CuBr2, when exposed to sunlight, silver and copper monohalides are formed, respectively. These processes take place with the participation of terminal cellulose molecules and also do not require the use of chemical reducing agents. In addition, it was found that copper monohalides can be converted into elemental copper particles by a photochemical reaction involving ascorbic acid. Examples of metallization of a number of dielectrics using photochemical activation using sunlight are given.