The Strength Analysis Of Cu/α−Al2O3 Interfaces As A Key For Rational Composite Design

Abstract

Abstract Electron back-scattered diffraction (EBSD) studies carried out for the Cu/α−Al2O3 composites manufactured by pulsed laser deposition method and by the powder metallurgy enable to uncover a set of orientation relationships characteristic for materials of this type. The identified interfaces are categorized according to the bonding strength. Additionally, their microstructure is reproduced by molecular dynamic (MD) simulations. The obtained classification of the phase boundaries constitutes key information for effective composite design.