Analytical Determination of Residual Stresses from Surface Topography Created by Laser Cutting Technology

Author:

Šafář Marek1,Harničárová Marta2,Kušnerová Milena2,Valíček Jan2

Affiliation:

1. Koyo Bearings Česká republika s.r.o., Pavelkova 253/5, 779 00 Olomouc , Czech Republic

2. Department of Mechanical Engineering, Faculty of Technology, Institute of Technology and Business in České Budějovice , Czech Republic

Abstract

Abstract This paper describes a numerical modeling method that utilizes stress equations derived from surface topography created by laser cutting technology. The explanatory ability of the geometric phenomena of the created surface topography is an essential analytical tool for the physical-mathematical formulation of the principle of laser cutting processes. As experimental meaterial was used structural steel of type S355J0 and CP-Ti Grade 2. A cutting machine from Prima Industry - ZAPHIRO / CV5000 was used. The new derived relations for the determination of the residual stress were determined and verified by experiment. The objective of this paper is to contribute to the understanding of process-related stresses and deformations generated by laser cutting technology, particularly by ultrasound testing of stress inside the material and significantly influenced by surface topography.

Publisher

Walter de Gruyter GmbH

Reference18 articles.

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3. [3] Czán A., Šajgalík M., Zaušková L., Drbúl, M.: Triaxial measurement method for analysis of residual stress after high feed milling using x-ray diffraction. In: Procedia Engineering. ISSN 1877-7058. Vol. 192 (2017), pp. 982-987.

4. [4] Šajgalík M., Pavlusík T., Pilc J., Mikloš M., Daniš I., Martinček J., Pustay J.: Identification of residual stress in the production of molding tools by turn-milling technology. In Technological engineering. ISSN 1336-5967. Vol. 14, no. 1 (2017) pp. 14-16.

5. [5] Ghany K.A, Newishy M. Cutting of 1.2mm thick austenitic stainless steel sheet using pulsed and CWNd:YAG laser. Journal of Materials Processing Technology 2005;168:438–47.

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