Effects of high polyamic acid content and curing process on properties of epoxy resins

Author:

Xu Xiaoyan1,Peng Jinchan1,Yang Jianjiang2,Hu Dedong3,Qian Duoduo1,Chang Zhihong1,Tan Qinggang1,Li Yan1

Affiliation:

1. School of Materials Science and Engineering, Tongji University , Shanghai 201804 , China

2. Research and Development Department, Shaoxing Jucheng New Material Technology Co., Ltd , Shaoxing 312500 , China

3. College of Electromechanical Engineering, Qingdao University of Science and Technology , Qingdao 266061 , China

Abstract

Abstract Epoxy/polyamic acid (EP/PAA) adhesives with high polyimide precursor-PAA content have been synthesized and then cured. The structure, thermal, and adhesive properties were investigated by Fourier transform infrared spectroscopy, thermogravimetric analysis, and tensile shear test. The effects of PAA content and curing process on the tensile shear strength were also studied. The results showed that the addition of PAA improved the heat resistance and reduced the water absorption. EP/PAA adhesive kept good adhesion. A kind of EP/PAA composite adhesive with excellent comprehensive properties was prepared in this study.

Publisher

Walter de Gruyter GmbH

Subject

Polymers and Plastics,Physical and Theoretical Chemistry,General Chemical Engineering

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