Effect of elevated test temperature on the tensile strength and failure mechanism of hot-pressed dissimilar joints of laser ablation-treated AA5754-H111 and thermoplastic composite

Author:

Öztoprak Nahit1ORCID,Gençer Gökçe Mehmet1

Affiliation:

1. Mechanical Engineering , Dokuz Eylül University , Izmir , Turkey

Abstract

Abstract Evaluation of directly bonded single-lap joint (SLJ) obtained using Al5754 alloy and 20 wt% long glass fiber-reinforced polypropylene (PP) is performed via the lap-shear testing at various temperatures. A fiber laser is used to form a multi-groove microstructure on the aluminum (Al) surface. The bonding regions are investigated microscopically before and after the mechanical testing. Dissimilar joint is manufactured under a 100 kN force at 200 °C for 60 min through hot-pressing technique without using any adhesives. Afterward, lap-shear strength of the joints is determined under elevated working temperatures (25, 75 and 125 °C). Damaged surfaces are also scrutinized for studying the failure mechanism of the joints. According to the experimental results, mechanical anchoring between the Al alloy substrate and thermoplastic composite (TPC) is formed at the interface through the applied laser treatment. Strength exhibits a significant decrease with the test temperature increasing from 25 to 125 °C. Fiber/matrix debonding is the dominant failure mode in the composite adherend. The SEM observations also highlight the pulled-out fibers in the PP composite at the elevated temperatures.

Publisher

Walter de Gruyter GmbH

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3