Die Kinetik und der Mechanismus der thermischen Reaktion zwischen Schwefeltetrafluorid und Fluor / The Kinetics and the Mechanism of the Thermal Reaction between Sulfurtetrafluoride and Fluorine

Author:

Gonzalez Alicia Cristina1,Schumacher Hans Joachim1

Affiliation:

1. Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas (INIFTA), Diag. 113 entre 63 y 64, C. C. 16, Sue. 4, 1900 La Plata, Argentina

Abstract

Abstract The kinetics of the thermal reaction between SF4 and F2 has been investigated between − 2.4 °C and + 24.0 °C, SF6 and very small amounts of S2F10 being the only products. The reaction is a chain reaction of medium length. Total pressure and surface have only insignificant influence. The reaction rate follows the equation: Under the experimental conditions less than 15% of the SF5 radicals are consumed by r (4b). Therefore Oxygen inhibits the reaction eliminating the SF5 radicals, the final products being now SF5O3SF5 and SF6. From the data obtained in the experiments with high oxygen pressures the rate constant of the primary process and the chain length (v) are determined. E = 10.8 ± 0.7 kcal, E1 = 11.9 ± 0.6 kcal and E4 ≃ 0. E2 = 5.0 ± 2.0 kcal (estimated value) and E3 = 4.7 ± 2.5 kcal.

Publisher

Walter de Gruyter GmbH

Subject

General Chemistry

Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Decomposition of high concentration SF6 using an electron beam;Radiation Physics and Chemistry;2016-07

2. From Further Oxidative Addition of Low Oxidation State Group-VIB Compounds;Inorganic Reactions and Methods;2007-05-29

3. Dissociative electron attachment to S2F10, S2OF10, and S2O2F10;The Journal of Chemical Physics;1993-06-15

4. Gas-phase combination reactions of SF4 and SF5 with F in plasmas of SF6;Plasma Chemistry and Plasma Processing;1988-09

5. Gas-phase chemistry in the processing of materials for the semiconductor industry;Critical Reviews in Solid State and Materials Sciences;1988-01

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