Microstructural Evolution of TLP Bonded Ti3Al-Nb Alloy Joints-Reference-Cited by-同舟云学术

Microstructural Evolution of TLP Bonded Ti3Al-Nb Alloy Joints

Published:2014-12-01 Issue:6 Volume:33 Page:525-529
ISSN:2191-0324
Container-title:High Temperature Materials and Processes
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Author:

Gu X.Y.¹,Duan Z.Z.²,Gu X.P.¹,Sun D.Q.¹

Affiliation:

1. 1Key Laboratory of Automobile Materials, School of Materials Science and Engineering, Jilin University, Changchun 130025, China

2. 2Changchun Railway Vehicles Co., Ltd., Changchun 130062, China

Abstract

AbstractIn the present study microstructural evolution in transient liquid phase (TLP) bonded Ti3Al-Nb alloy joints using a pure copper as interlayer was investigated. TLP bonded Ti3Al-Nb alloy joints composed of intermetallic compound layers were produced. Microstructural evolution of joints depended on both bonding time and bonding temperature. With increasing bonding time and bonding temperature, the joint width increased and amount of compounds in the joint decreased. The joint microstructure at 1173 K × 1 min mainly consisted of Ti (solid solution) + Ti2Cu + TiCu + Ti3Cu4 + Ti2Cu3 + TiCu4 + Cu (solid solution) phase and it changed to Ti (solid solution) + Ti2Cu + TiCu at 1223 K × 60 min. Compounds formed on cooling from the bonding temperature by liquid phase were eliminated from the joint at 1223 K × 60 min due to isothermal solidification of liquid phase. The increase of the width of joint is attributed to the composition difference between the isothermal solidification production and its adjacent base material.

Publisher

Walter de Gruyter GmbH

Subject

Physical and Theoretical Chemistry,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.degruyter.com/downloadpdf/journals/htmp/33/6/article-p525.xml

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