Interfacial behavior between particle and matrix in a composite rubber material

Abstract

AbstractElectronic holography moiré is applied to the measurement of interfacial deformation field between an embedded particle and its surrounding matrix in a non-homogeneous rubber material. A tensile specimen is subjected to creep loading. The loads are applied in steps and measurements are carried out at equal intervals of time. The final output is provided by the Holo-Moiré Strain Analyzer and gives the principal strains and their directions in the region of observation. A definition of adhesion as an experimental measurable quantity through the evaluation of contour integrals is introduced.