Effect of TiB2 addition on the microstructural, electrical, and mechanical behavior of Cu–TiB2 composites processed via spark plasma sintering

Author:

Ayyappadas C12,Teja Ravi2,Annamalai A. Raja3,Agrawal Dinesh K4,Dilkush Shaik5,Muthuchamy A.6

Affiliation:

1. Department of Mechanical Engineering, NSS College of Engineering, Palakkad , Kerala , India

2. Department of Manufacturing Engineering, School of Mechanical Engineering, VIT , Vellore , Tamil Nadu , India

3. Centre for Innovative Manufacturing Research (CIMR), VIT , Vellore , Tamil Nadu , India

4. Materials Research Institute, Pennsylvania State University , Pennsylvania USA

5. Department of Metallurgical and Materials Engineering , RGUKT Nuzvid , India

6. Department of Metallurgical and Materials Engineering, NIT Tiruchirappalli , India

Abstract

Abstract In this investigation, copper–TiB2 metal matrix composites were fabricated by spark plasma sintering. The effect of TiB2 (2.5, 5, 7.5, and 10 wt.%) additions on the microstructural, electrical, and mechanical properties of the composites was investigated. There was a remarkable reduction in processing time and temperature by this process as compared to conventional sintering. Scanning electron microscopy with energy dispersive X-ray spectroscopy elemental maps revealed a homogeneous distribution of TiB2 in the copper matrix. The hardness of the composites exhibited no consistent trend with the addition of TiB2. An improvement in tensile strength was observed at the expense of ductility. Electrical conductivity showed a decreasing trend. Morphology of the fracture surfaces was analyzed to predict the nature of failure under tensile load.

Publisher

Walter de Gruyter GmbH

Subject

Materials Chemistry,Metals and Alloys,Physical and Theoretical Chemistry,Condensed Matter Physics

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