Automation of the test procedure for accelerated aging of implant packages

Author:

Koker Liane1,Nagel Jörg A.2,Schulz Bernhard3,Ritter Fabian4,Vollmannshauser Stefan1,Besser Heino5,Gengenbach Ulrich1

Affiliation:

1. Karlsruhe Institute of Technology (KIT), Institute for Applied Computer Science, Hermann-von-Helmholtz-Platz 1, 76344 Eggenstein-Leopoldshafen, Germany Germany

2. Pepperl+Fuchs GmbH, Lilienthalstrasse 200, 68307 Mannheim, Germany Germany

3. Network INGenieursgesellschaft mbH, Hohlohstr. 8, 75334 Straubenhardt, Germany Germany

4. CreaTec Fischer & Co. GmbH, Industriestr. 9, 74391 Erligheim, Germany Germany

5. Karlsruhe Institute of Technology (KIT), Institute for Applied Materials, Hermann-von-Helmholtz-Platz 1, 76344 Eggenstein-Leopoldshafen, Germany Germany

Abstract

Abstract An automated accelerated aging test procedure is presented to estimate the lifetime of implant packages regarding hermeticity. Intruding humidity is captured automatically in packages at two elevated temperatures using a resonant circuit comprised of capacitive humidity sensor and coil in coupling with an external coil. Described are the test stand setup including sensor calibration and evaluation, data acquisition and processing. In a first application the safe and reliable operation of the setup is demonstrated.

Publisher

Walter de Gruyter GmbH

Subject

Electrical and Electronic Engineering,Computer Science Applications,Control and Systems Engineering

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