Modification and Characterization of Nano-Ag/TiO2 Antimold Agent for Wood Materials

Author:

Lin Lin,Yang Yingni,Via Brian K.,Liu Yi,Guo Hongwu,Zhang Fan

Abstract

Abstract Nano-Ag/TiO2 exhibits effective antimicrobial activities; however, its tendency to aggregate limits its application in wood products for improved antimold properties. In this study, nano-Ag/TiO2 was modified by a silane coupling agent (γ-aminopropyltriethoxysilane [KH-550]) and then loaded into wood via vacuum impregnation. The effects of KH-550 concentration, Ag/TiO2 concentration, reaction temperature, and incubation time on the antimold rate, loading amount, and leach resistance for wood materials were investigated. Results showed that the antimold rate, loading amount, and fixation rate of mold-proof–treated wood was strengthened by KH-550 modification. The binding affinity and surface energy of nano-Ag/TiO2 was reduced, and the dispersivity of nano-Ag/TiO2 particles was improved after modification. Observation by field emission scanning electron microscopy showed that the modified nano-Ag/TiO2 penetrated into the wood tracheids and formed a tight flocculent structure. X-ray diffractive analysis confirmed that modification did not affect the anatase diffraction pattern of nano-Ag/TiO2 or its photocatalytic and antimicrobial activities. Characterization by Fourier transform infrared spectroscopy showed that modified nano-Ag/TiO2 efficiently cross-linked with wood hydroxyl groups. This work provided a simple and effective method to develop a novel nano-Ag/TiO2 antimold agent for wood mold-proof treatment.

Publisher

Forest Products Society

Subject

Plant Science,General Materials Science,Forestry

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3