Cost Savings from Soy Flour Substitution in Methylene Diphenyl Diisocyanate for Bonding Flakes and Particle

Abstract

Abstract Methylene diphenyl diisocyanate (pMDI) adhesive used in the manufacture of oriented strand board and particleboard can be partially substituted with soy flour for significant cost savings. The flour is about one-third of the cost of pMDI. Properties such as internal bond, wet modulus of elasticity and modulus of rupture, and thickness swelling are unaffected by soy flour substitution of up to 20 percent. Adding soy flour to the regular dose of pMDI can improve board properties and reduce delamination.