Integrated Silicon-based Optical Interconnect for Fast, Compact, Energy-efficient Electronic Circuit Systems
Author:
Affiliation:
1. NTT Microsystem Integration Laboratories, NTT Corporation
2. Photonics and Electronics Convergence System Technology (PECST) project
3. NEC Corporation
4. Photonics Electronics Technology Research Association (PETRA)
5. The University of Tokyo
Publisher
NTT Science and Core Technology Laboratory Group
Reference6 articles.
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2. International Technology Roadmap for Semiconductors, 2009 edition
3. T. Nakamura, Y. Urino, T. Usuki, J. Fujikata, M. Ishizaka, K. Yamada, H. Yaegashi, T. Horikawa, and Y. Arakawa, “Silicon Photonics Integrated Circuits for High-Density Optical Interconnects,” Proc. of the 2012 IEICE General Conference, CI-3-3, Okayama, Japan, 2012 (in Japanese).
4. Y. Urino, T. Shimizu, M. Okano, N. Hatori, M. Ishizaka, T. Yamamoto, T. Baba, T, Akagawa, S. Akiyama, T. Usuki, D. Okamoto, M. Miura, M. Noguchi, J. Fujikata, D. Shimura, H. Okayama, T. Tsuchizawa, T. Watanabe, K. Yamada, S. Itabashi, E. Saito, T. Nakamura, and Y. Arakawa, “First demonstration of high density optical interconnects integrated with lasers, optical modulators, and photodetectors on single silicon substrate,” Optics Express, Vol. 19, No. 26, pp. B159–B165, 2011.
5. T. Shimizu, N. Hatori, M. Okano, M. Ishizaka, Y. Urino, T. Yamamoto, M. Mori, T. Nakamura, and Y. Arakawa, “High Density Hybrid Integrated Light Source with a Laser Diode Array on a Silicon Optical Waveguide Platform for Inter-Chip Optical Interconnection,” Proc. of the 8th IEEE International Conference on Group IV Photonics, London, UK, 2011.
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