Decomposition of SF6in an RF Plasma Environment-Reference-Cited by-同舟云学术

Decomposition of SF6in an RF Plasma Environment

Published:2002-11 Issue:11 Volume:52 Page:1274-1280
ISSN:1096-2247
Container-title:Journal of the Air & Waste Management Association
language:en
Short-container-title:Journal of the Air & Waste Management Association

Author:

Shih Minliang¹,Lee Wen-Jhy¹,Tsai Cheng-Hsien¹,Tsai Perng-Jy²,Chen Chuh-Yung³

Affiliation:

1. a Department of Environmental Engineering , National Cheng Kung University , Tainan , Taiwan

2. b Department of Environmental and Occupational Health, Medical College , National Cheng Kung University , Tainan , Taiwan

3. c Department of Chemical Engineering , National Cheng Kung University , Tainan , Taiwan

Publisher

Informa UK Limited

Subject

Management, Monitoring, Policy and Law,Waste Management and Disposal

Link

https://www.tandfonline.com/doi/pdf/10.1080/10473289.2002.10470864

Reference8 articles.

1. Kline, L.E. Electron and Chemical Kinetics in the Low-Pressure RF Discharge Etching of Silicon in SF6;IEEE Trans. Plasma Sci.1986,PS-14, 145-155.

2. Chu, F.Y. SF6Decomposition in Gas-Insulated Equipment;IEEE Trans. Electr. Insul.1986,EI-21, 693-725.

3. Piemontesi, M.; Niemeyer, L. Sorption of SF6and SF6Decomposition Products by Activated Alumina and Molecular Sieve 13X. InConference Record of the IEEE International Symposium on Electrical Insulation, Montreal, Quebec, Canada, June 16-19, 1996; p 828-838.

4. Olthoff, J.K.; Van Brunt, R.J.; Herron, J.T. Catalytic Decomposition of S2F10and Its Implication on Sampling and Detection from SF6-Insu-lated Equipment. InConference Record of the IEEE International Symposium on Electrical Insulation, Toronto, Canada, June 3–6, 1990; p 248-252.

5. Sauser, I.; Mahajan, S.M.; Cacheiro, R.A. Effects of a Solid Insulator on the Spark Yield of S2F10in SF6. InConference Record of the IEEE International Symposium on Electrical Insulation, Pittsburgh, PA, June 5–8, 1994; p 518-521.

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