Joining of alumina ceramics using silicon–magnesium composite filler for high-temperature applications
Author:
Affiliation:
1. Kyoto Municipal Institute of Industrial Technology and Culture, Kyoto, Japan
Publisher
Informa UK Limited
Subject
Condensed Matter Physics,General Materials Science
Link
https://www.tandfonline.com/doi/pdf/10.1080/13621718.2020.1714874
Reference25 articles.
1. New approaches to joining ceramics for high-temperature applications
2. Joining of alumina via copper/niobium/copper interlayers
3. Joining of ceramic materials using niobium and niobium-based alloys
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