Estimation of the IGBT Silicon Temperature During Short-Circuit Condition in Order to Determine the Failure Mode

Author:

Calmon F.,Chante J.-P.,Sénès A.,Reymond B.

Publisher

Informa UK Limited

Subject

Electrical and Electronic Engineering

Reference12 articles.

1. Eckel, H.G.: Sack, L.: Optimization of the short-circuit behaviour of NPT-IGBT by the gate drive. Proceedings of 6th European Conference on Power Electronics & Applications. September 18.21.1995. Sevilla, Spain. pp. 2.213–2118.

2. Farjah, E.; Schaeffer. Ch.; Ferret, R.: Experimental thermal parameter extraction using non-destructive tests. Proceedings of 6th European Conference on Power Electronics & Applications, September 18–21. 1995, Sevilla, Spain, pp. 1.245–1.248.

3. Duong, S.; Raël, S.: Schaeffer, Ch.; De Palma J. F.: Short-circuit behaviour for PT and NPT IGBT devices – Protection against explosion of the case by fuses. Proceedings of 6th European Conference on Power Electronics & Applications. September 18–21, 1995, Sevilla, Spain, pp. 1.249–1.254.

4. Abid, R.; Miserey, F.: Temperature non contact measurements on the surface of a GTO thyristor in commutation, Proceedings of 6th European Conference on Power Electronics & Applications, September 18–21, 1995. Sevilla. Spain, pp. 2.191–2,196.

5. Axelrod, V.: Klein, R.; Electrothermal simulation of an IGBT, Proceedings of 1992 International Symposium on Power Semiconductor Devices & ICs, Tokyo. pp. 158–159.

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