Neural Network-based Fast and Intelligent Signal Integrity Assessment Model for Emerging MWCNT Bundle On-Chip Interconnects in Integrated Circuit-Reference-Cited by-同舟云学术

Neural Network-based Fast and Intelligent Signal Integrity Assessment Model for Emerging MWCNT Bundle On-Chip Interconnects in Integrated Circuit

Published:2023-02-26 Issue: Volume: Page:1-16
ISSN:0377-2063
Container-title:IETE Journal of Research
language:en
Short-container-title:IETE Journal of Research

Author:

Bhatti Gulafsha¹,Pathade Takshashila¹,Agrawal Yash¹,Palaparthy Vinay¹,Gohel Bakul¹,Parekh Rutu¹,Girish Kumar Mekala²

Affiliation:

1. VLSI and Embedded Systems Research Group, Dhirubhai Ambani Institute of Information and Communication Technology, Gandhinagar, Gujarat 382007, India

2. Electronics and Communication Engineering Department, TKR college of Engineering and Technology, Hyderabad, Telangana 500097, India

Publisher

Informa UK Limited

Subject

Electrical and Electronic Engineering,Computer Science Applications,Theoretical Computer Science

Link

https://www.tandfonline.com/doi/pdf/10.1080/03772063.2023.2177201

Reference35 articles.

1. Review of the Global Trend of Interconnect Reliability for Integrated Circuit

2. International Technology Roadmap for Semiconductors. Available: http://www.itrs2.net.

3. Simulation of high-speed interconnects

4. A Temperature and Dielectric Roughness-Aware Matrix Rational Approximation Model for the Reliability Assessment of Copper– Graphene Hybrid On-Chip Interconnects

5. Edge and Dielectric Surface Roughness-Aware EM-RA Model for MLGNR Interconnects

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