Dynamic Analysis Of Multilayered Microwave Circuits Including Metallization Effects-Reference-Cited by-同舟云学术

Dynamic Analysis Of Multilayered Microwave Circuits Including Metallization Effects

Published:2008-01 Issue:4 Volume:28 Page:462-469
ISSN:0228-6203
Container-title:International Journal of Modelling and Simulation
language:en
Short-container-title:International Journal of Modelling and Simulation

Author:

Tounsi M.L.¹,Touhami R.²,Yagoub M.C.E.¹

Affiliation:

1. Instrumentation Laboratory, Faculty of Electronics and Informatics U.S.T.H.B. University, P.O. Box 32, El-Alia, Bab-Ezzouar, 16111, Algiers, Algeria;,

2. School of Information Technology and Engineering, University of Ottawa, 800 King Edward, Ottawa, Ontario, K1N 6N5, Canada;

Publisher

Informa UK Limited

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Mechanics of Materials,Modelling and Simulation,Software

Link

https://www.tandfonline.com/doi/pdf/10.1080/02286203.2008.11442499

Reference25 articles.

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2. M.L. Tounsi, A. Khodja, & M.C.E. Yagoub, Efficient analysis of multilayered broadside edge-coupled anisotropic structures for microwave applications,IEEE Int . Symp. on Circuits and Systems, Vancouver, BC, Canada, May 23–26, 2004, 229–232.

3. Z. Ma, E. Yamashita, & S. Xu, Hybrid-mode analysis of planar transmission lines with arbitrary metallization cross sections,IEEE Trans. Microwave Theory Tech., 41 , March 1993, 491–497.

4. R.A. Pucel, D.J. Mas, & C.P. Hartwig, Losses in microstrip,IEEE Transactions on Microwave Theory Technology, 16, June 1968, 342–350.

5. W. Heinrich, Full-wave analysis of conductor losses on MMIC transmission lines,IEEE Transactions on Microwave Theory Technology, 38, October 1990, 1468–1472.