THE LATEST ADVANCES IN HIGH-DIELECTRIC THIN-FILM CAPACITOR TECHNOLOGY FOR GHz-RF DEVICES-Reference-Cited by-同舟云学术

THE LATEST ADVANCES IN HIGH-DIELECTRIC THIN-FILM CAPACITOR TECHNOLOGY FOR GHz-RF DEVICES

Published:2005-11 Issue:1 Volume:76 Page:47-57
ISSN:1058-4587
Container-title:Integrated Ferroelectrics
language:en
Short-container-title:Integrated Ferroelectrics

Author:

SUZUKI TOSHIMASA¹,MORITO KENTARO¹,IWAZAKI YOSHIKI¹

Affiliation:

1. a Advanced Technology Development Division , Taiyo Yuden Co. Ltd., 5607-2 , Nakamuroda, Haruna-machi, Gunma, 370-3347, Japan

Publisher

Informa UK Limited

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Ceramics and Composites,Control and Systems Engineering,Electronic, Optical and Magnetic Materials

Link

https://www.tandfonline.com/doi/pdf/10.1080/10584580500413525

Reference23 articles.

1. Reconfigurable RFICs in Si-based technologies for a compact intelligent RF front-end

2. Base-Metal Electrode-Multilayer Ceramic Capacitors: Past, Present and Future Perspectives

3. Thin-film inductor for gigahertz band with CoFeSiO-SiO/sub 2/2 multilayer granular films and its application for power amplifier module

4. Special Issue Ceramics Integration. Advanced Microwave Integrated Circuits with Ceramic Integration Technologies.

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