Affiliation:
1. a Department of Electronic Materials Engineering , Kwangwoon Univ. , Seoul , Korea
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Ceramics and Composites,Control and Systems Engineering,Electronic, Optical and Magnetic Materials
Reference7 articles.
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al , et . 2001. Fundamentals of Microsystems Packaging, Edited by:
Tummala , R. R. 420New York: McGraw-hill Book Company. Chap. 11
2. Rector , J. Proc. of 48th Electronic Components and technology Conf. Seattle, Wa. pp.218
3. Integral passives for next generation of electronic packaging: application of epoxy/ceramic nanocomposites as integral capacitors
4. Novel polymer-ceramic nanocomposite based on high dielectric constant epoxy formula for embedded capacitor application
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