THIN FILM PROCESSING AND INTEGRATION METHODS TO ENALE AFFORDALE MOILE COMMUNICATIONS SYSTEMS-Reference-Cited by-同舟云学术

THIN FILM PROCESSING AND INTEGRATION METHODS TO ENALE AFFORDALE MOILE COMMUNICATIONS SYSTEMS

Published:2005-07 Issue:1 Volume:71 Page:29-44
ISSN:1058-4587
Container-title:Integrated Ferroelectrics
language:en
Short-container-title:Integrated Ferroelectrics

Author:

COLE M. W.¹,NOTHWANG W. D.¹,JOSHI P. C.²,HIRSCH S.³,DEMAREE J. D.¹

Affiliation:

1. a U.S. Army Research Laoratory, Weapons and Materials Research Directorate, Aerdeen Proving Ground , MD, 21005, USA

2. b Sharp Laoratories of America, Inc., 5700 NW Pacific Rim Boulevard , Camas, WA, 98607, USA

3. c Oak Ridge Institute for Science & Education (ORISE), PO Box 117 , Oak Ridge, TN, 37831-0117, USA

Publisher

Informa UK Limited

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Ceramics and Composites,Control and Systems Engineering,Electronic, Optical and Magnetic Materials

Link

https://www.tandfonline.com/doi/pdf/10.1080/10584580590965032

Reference14 articles.

1. Private Communication;Coryell L.,2003

2. Frequency Agile Materials for Electronics (FAME)-Progress in the DARPA Program

3. Microstructure and Chemistry of Nonstoichiometric (Ba,Sr)TiO3 Thin Films Deposited by Metalorganic Chemical Vapor Deposition

4. Microstructure and Electrical Properties of Tantalum Oxide Thin Film Prepared by Electron Cyclotron Resonance Plasma-Enhanced Chemical Vapor Deposition

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