Experimental investigation and numerical simulation analysis of sintered micro-fluidic devices
Author:
Affiliation:
1. Applied Mechanics Department, University of Bourgogne-Franche-Comté, COMUE UBFC, Femto-ST Institute, Besançon France
Publisher
Informa UK Limited
Subject
Materials Chemistry,Metals and Alloys,Mechanics of Materials,Condensed Matter Physics,Ceramics and Composites
Link
https://www.tandfonline.com/doi/pdf/10.1080/00325899.2019.1706868
Reference20 articles.
1. A review of biocompatible metal injection moulding process parameters for biomedical applications
2. Processing of MIM feedstocks based on Inconel 718 powder and partially water-soluble binder varying in PEG molecular weight
3. Effect of the particle size and solids volume fraction on the thermal degradation behaviour of Invar 36 feedstocks
4. The degradation of poly(ethylene glycol) in an Inconel 718 feedstock in the metal injection moulding process
5. Metal injection moulding of titanium and titanium alloys: Challenges and recent development
Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Optimization of Printing Parameters to Achieve High-Density 316L Stainless Steel Manufactured by Binder Jet 3D Printing;Journal of Materials Engineering and Performance;2022-09-19
2. Influence of initial relative densities on the sintering behavior and mechanical behavior of 316 L stainless steel fabricated by binder jet 3D printing;Materials Today Communications;2022-06
3. Numerical Simulation of Particle Size Influence on the Sintering Behavior of 316L Stainless Steel Powders Fabricated by Binder Jet 3D Printing;Journal of Materials Engineering and Performance;2021-04-05
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3