Creep behavior of an epoxy resin cured under hydrostatic pressure-Reference-Cited by-同舟云学术

Creep behavior of an epoxy resin cured under hydrostatic pressure

Published:1997-07 Issue:4 Volume:36 Page:475-485
ISSN:0022-2348
Container-title:Journal of Macromolecular Science, Part B
language:en
Short-container-title:Journal of Macromolecular Science, Part B

Author:

Lee Jong Keun¹,Pae K. D.²

Affiliation:

1. a Department of Polymer Science and Engineering , Kumoh National University of Technology Kumi , Kyungbuk, 730-701, Korea

2. b High Pressure Materials Research Laboratory and Department of Mechanical and Aerospace Engineering , Rutgers University , Piscataway, 08855-0909, New Jersey

Publisher

Informa UK Limited

Subject

Materials Chemistry,Polymers and Plastics,Condensed Matter Physics,General Chemistry

Link

https://www.tandfonline.com/doi/pdf/10.1080/00222349708220436

Reference8 articles.

1. Synthesis and properties of new polyimides containing flourinated alkoxy side chains

2. Effects of hydrostatic pressure on curing of a DGEBA-DDS system

3. Mechanical and Thermal Properties of a Diglycidyl Ether of Bisphenol-A (DGEBA)–4,4′-Diaminodiphenyl Sulfone (DDS) System Cured under Hydrostatic Pressure

4. Effect of physical aging on tensile stress relaxation and tensile creep of cured EPON 828/epoxy adhesives in the linear viscoelastic region

5. The physical properties of bisphenol-A-based epoxy resins during and after curing

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