Synthesis of dispensable PDMS/Al2O3/GO thermal gap filler and performance comparison with commercial thermal gap fillers for electronics packaging applications-Reference-Cited by-同舟云学术

Synthesis of dispensable PDMS/Al2O3/GO thermal gap filler and performance comparison with commercial thermal gap fillers for electronics packaging applications

Published:2021-04-05 Issue: Volume: Page:1-10
ISSN:1066-7857
Container-title:Materials Technology
language:en
Short-container-title:Materials Technology

Author:

Kumaresan Vigneshwarram¹²^ORCID,Sreekantan Srimala¹^ORCID,Devarajan Mutharasu²,Mohamed Khairudin³^ORCID

Affiliation:

1. School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia, Engineering Campus, Nibong Tebal, Malaysia

2. Materials Centre of Excellence (MCoE), PTDI, Western Digital Corporation, Batu Kawan, Malaysia

3. School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, Nibong Tebal, Malaysia

Funder

WDC-USM

Publisher

Informa UK Limited

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.tandfonline.com/doi/pdf/10.1080/10667857.2021.1908788

Reference43 articles.

1. Miraglia C. Compression Characteristics of thermal interface gap filler materials; USA.

2. Bunyan MH, Fe VS, Fully-Cured JB Thermally or electrically conductive form-in-place gap filler. US 2012/0133072 A1, 2012.

3. Yamazaki T, Tsutomu Kashiwagi MW Addition-curable silicone resin composition and deattach material for optical semiconductor device. Us 2016/0251482 A1, 2016.

4. Tsuji K. Thermal conductive silicone composition. US 2019/0275755 A1, 2018.

5. Zhang L, Zhang K, Ling Shen YQL Gel type thermal interface materials. US 2018/0030328 A1, 2018.

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Promoting Thermal Conductivity of Alumina-Based Composite Materials by Systematically Incorporating Modified Graphene Oxide;Crystals;2024-05-23