Nondestructive measurement of bond line thickness and die tilt in the die attach for semiconductor packaging-Reference-Cited by-同舟云学术

Nondestructive measurement of bond line thickness and die tilt in the die attach for semiconductor packaging

Published:2008-04-11 Issue:2 Volume:23 Page:89-98
ISSN:1058-9759
Container-title:Nondestructive Testing and Evaluation
language:en
Short-container-title:Nondestructive Testing and Evaluation

Author:

Chang Ming,Deka Juti Rani,Tseng Kai-Ming

Publisher

Informa UK Limited

Subject

General Physics and Astronomy,Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://www.tandfonline.com/doi/pdf/10.1080/10589750701775700

Reference4 articles.

1. Bhandarkar, N., Mhaisalkar, S., Lee, P. and Tracy, D., Effect of Package Construction on Thermal Performance of Plastic IC Packages, 1997, IEEE/CPMT Electronic Packaging Technology Conference, Singapore.

2. Behler, S., Limits of Epoxy Bond Line Thickness Control, 2006, SEMICON® Singapore.

3. Non-contact scanning measurement utilizing a space mapping method

4. Digital image processing based approach for tunnel excavation faces

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