Correspondence: Grain boundaries in thin-film bicrystals of surface-reactive metals prepared by vacuum welding-Reference-Cited by-同舟云学术

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Correspondence: Grain boundaries in thin-film bicrystals of surface-reactive metals prepared by vacuum welding

Published:1974-09 Issue:3 Volume:30 Page:673-678
ISSN:0031-8086
Container-title:Philosophical Magazine
language:en
Short-container-title:Philosophical Magazine

Author:

Wagner W. R.,Balluffi R. W.

Publisher

Informa UK Limited

Link

http://www.tandfonline.com/doi/pdf/10.1080/14786439808206590

Reference9 articles.

1. Electron microscope studies of grain boundary dislocation behavior

2. A field ion microscope study of atomic configuration at grain boundaries

3. The study of epitaxy in thin surface films

4. Comments on the Vapor Deposition of Epitaxial Silver and Gold Films on Rocksalt

Cited by 13 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Energies of [001] small angle grain boundaries in aluminum;Journal of Materials Science;2005-06

2. Bicrystal growth and characterization of copper twist grain boundaries;Journal of Crystal Growth;2001-01

3. Materials science through materials synthesis;Journal of Physics and Chemistry of Solids;1994-10

4. ON COMPARISONS BETWEEN COMPUTED AND OBSERVED GRAIN BOUNDARY STRUCTURES AND PROPERTIES IN METALS;Le Journal de Physique Colloques;1985-04

5. On the structure of grain boundaries in metals;Materials Science and Engineering;1982-02

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