A review on existing pre-treatment techniques of waste printed circuit boards-Reference-Cited by-同舟云学术

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A review on existing pre-treatment techniques of waste printed circuit boards

Published:2024-01-31 Issue: Volume: Page:1-17
ISSN:0008-4433
Container-title:Canadian Metallurgical Quarterly
language:en
Short-container-title:Canadian Metallurgical Quarterly

Author:

Jha Rohit¹,Agrawal Munmun¹,Jena Arundhati²,Mishra Gautam¹,Verma Himanshu Ranjan¹,Meshram Arunabh³,Singh Kamalesh K.¹

Affiliation:

1. Department of Metallurgical Engineering, Indian Institute of Technology (Banaras Hindu University), Varanasi, India

2. Department of Metallurgical and Materials Engineering, Indian Institute of Technology, Kharagpur, India

3. Department of Materials Science and Engineering, Indian Institute of Technology, Kanpur, India

Publisher

Informa UK Limited

Link

https://www.tandfonline.com/doi/pdf/10.1080/00084433.2024.2310348

Reference104 articles.

1. E-waste in the international context – A review of trade flows, regulations, hazards, waste management strategies and technologies for value recovery

2. A different approach to the electronic waste handling – A review

3. Global market trends of tantalum and recycling methods from Waste Tantalum Capacitors: A review

4. Recycling copper and gold from e-waste by a two-stage leaching and solvent extraction process

5. Opportunities for an en-route to polymer inclusion membrane approach from conventional hydrometallurgical recycling of WPCBs: a mini-review

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