A new lead-to-pad alignment technique for surface-mount component placement
Author:
Publisher
Informa UK Limited
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanical Engineering,Aerospace Engineering
Link
http://www.tandfonline.com/doi/pdf/10.1080/095119298130831
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
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