Author:
İzci Türker,Koz Mustafa,Koşar Ali
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference38 articles.
1. High-performance heat sinking for VLSI
2. Phillips, R.J., Micro-Channel Heat Sinks, Advances in Thermal Modeling of Electronic Components, eds. A. Bar-Cohen and A.D. Kraus, ASME, New York, NY, vol. 36, pp. 109–184, 1990.
3. Heat sink optimization with application to microchannels
4. Developing convective heat transfer in deep rectangular microchannels
5. Three-dimensional conjugate heat transfer in the microchannel heat sink for electronic packaging
Cited by
98 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献