An Analytical-Computational Model for Predicting the Temperature of a Computer Central Processing Unit Cooler
Author:
Affiliation:
1. Department of Mechanical and Mechatronics Engineering, Southern Illinois University Edwardsville, Edwardsville, Illinois, USA
Publisher
Informa UK Limited
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Link
https://www.tandfonline.com/doi/pdf/10.1080/01457632.2021.1953746
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1. Design of a single-phase immersion cooling system through experimental and numerical analysis
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3. Ultra-thin flattened heat pipe with a novel band-shape spiral woven mesh wick for cooling smartphones
4. Electronic chipset thermal management using a nanofluid-based mini-channel heat sink: An experimental study
5. Experimental study on thermo-hydraulic performance of nanofluids in CPU heat sink with rectangular grooves and cylindrical bugles based on exergy efficiency
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1. EFFECT OF GEOMETRIC PARAMETERS ON THE HEAT TRANSFER PERFORMANCE OF COMPUTER CPU COOLERS;Proceeding of 8th Thermal and Fluids Engineering Conference (TFEC);2023
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