Mini-Contact Enhanced Thermoelectric Coolers for On-Chip Hot Spot Cooling-Reference-Cited by-同舟云学术

Mini-Contact Enhanced Thermoelectric Coolers for On-Chip Hot Spot Cooling

Published:2009-08 Issue:9 Volume:30 Page:736-743
ISSN:0145-7632
Container-title:Heat Transfer Engineering
language:en
Short-container-title:Heat Transfer Engineering

Author:

Wang Peng,Yang Bao,Bar-Cohen Avram

Publisher

Informa UK Limited

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Link

http://www.tandfonline.com/doi/pdf/10.1080/01457630802678391

Reference24 articles.

1. Watwe, A. and Viswanath, R. 2003. Thermal Implications of Non-Uniform Die Power Map and CPU Performance. Presented at Proceedings of InterPACK1903. July6–112003, Maui, HI.

2. 2008. http://www.micropelt.com

3. Semenyuk, V. 2001. Thermoelectric Micro Modules for Spot Cooling of High Density Heat Sources. Presented at Proceedings of the 20th International Conference on Thermoelectrics. June8–112001, Beijing, China.

4. Thin-film thermoelectric devices with high room-temperature figures of merit

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