Experimental investigation of substrate board orientation effect on the optimal distribution of IC chips under forced convection
Author:
Affiliation:
1. Department of Thermal and Energy Engineering, School of Mechanical Engineering, Vellore Institute of Technology (VIT), Vellore, India
Publisher
Informa UK Limited
Subject
Electrical and Electronic Engineering,Instrumentation,Control and Systems Engineering
Link
https://www.tandfonline.com/doi/pdf/10.1080/08916152.2020.1793827
Reference30 articles.
1. Transient response of protruding electronic modules exposed to horizontal cross flow
2. Experimental investigation of mixed convection heat transfer in a rectangular channel with discrete heat sources at the top and at the bottom
3. Air Cooling of Variable Array of Heated Modules in a Vertical Channel
4. Convective cooling of three discrete heat sources in channel flow
5. Mixed convection air cooling of protruding heat sources mounted in a horizontal channel
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