A Comparative Risk Assessment of Casting Solvents for Positive Photoresist-Reference-Cited by-同舟云学术

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A Comparative Risk Assessment of Casting Solvents for Positive Photoresist

Published:1989-04 Issue:4 Volume:4 Page:81-87
ISSN:0882-8032
Container-title:Applied Industrial Hygiene
language:en
Short-container-title:Applied Industrial Hygiene

Author:

Boggs Angela

Publisher

Informa UK Limited

Subject

Public Health, Environmental and Occupational Health

Link

http://www.tandfonline.com/doi/pdf/10.1080/08828032.1989.10390358

Reference30 articles.

1. Summary and overview: NIOSH Symposium on Toxic Effects of Glycol Ethers

2. American Conference of Governmental Industrial Hygienists. Threshold Limit Values and Biological Exposure Indices for 1988–1989. Cincinnati

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Photolithography;Materials Science and Technology;2013-02-15

2. Ethyl-3-ethoxypropionat [MAK Value Documentation in German language, 2007];The MAK-Collection for Occupational Health and Safety;2012-01-31

3. Patterns of chemical use and exposure control in the semiconductor health study;American Journal of Industrial Medicine;2010-08-16

4. Toxicological Investigations in the Semiconductor Industry;Toxicology and Industrial Health;1995-01

5. Glove Permeation by Propylene Glycol Monomethyl Ether Acetate — A Photoresist Solvent Used in Semiconductor Device Processing;Applied Occupational and Environmental Hygiene;1992-06

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