Microstructure development during directional solidification of Sn–Ag–Cu ternary alloys-Reference-Cited by-同舟云学术

Microstructure development during directional solidification of Sn–Ag–Cu ternary alloys

Published:2017-09-26 Issue:2 Volume:31 Page:118-124
ISSN:1364-0461
Container-title:International Journal of Cast Metals Research
language:en
Short-container-title:International Journal of Cast Metals Research

Author:

Fornaro Osvaldo¹²^ORCID,Morando Carina¹²

Affiliation:

1. Instituto de Física de Materiales Tandil — IFIMAT, Tandil, Argentina.

2. Centro de Investigaciones en Física e Ingeniería del Centro de la Provincia de Buenos Aires — CIFICEN, Universidad Nacional del Centro de la Provincia de Buenos Aires (UNCPBA — CICPBA — CONICET), Tandil, Argentina.

Funder

ANPCyT

CONICET

Universidad Nacional del Centro de la Provincia de Buenos Aires

Publisher

Informa UK Limited

Subject

Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Link

https://www.tandfonline.com/doi/pdf/10.1080/13640461.2017.1379261

Reference29 articles.

1. Dendrite growth in eutectic alloys: the coupled zone

2. The structures expected in a simple ternary eutectic system: Part 1. Theory

3. The structures expected in a simple ternary eutectic system: Part II. The Al-Ag-Cu ternary system

4. Directional solidification in a AgCuSn eutectic alloy

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