Grain boundary diffusion and recrystallization in Cu-Pb thin films-Reference-Cited by-同舟云学术

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Grain boundary diffusion and recrystallization in Cu-Pb thin films

Published:1977-05 Issue:5 Volume:35 Page:1333-1344
ISSN:0031-8086
Container-title:The Philosophical Magazine: A Journal of Theoretical Experimental and Applied Physics
language:en
Short-container-title:The Philosophical Magazine: A Journal of Theoretical Experimental and Applied Physics

Author:

Campisano S. U.¹,Costanzo E.¹,Rimini E.¹

Affiliation:

1. a Institute di Struttura della Materia del'Università di Catania Corso Italia , 57-195129 , Catania , Italy

Publisher

Informa UK Limited

Link

https://www.tandfonline.com/doi/pdf/10.1080/14786437708232956

Reference14 articles.

1. Special aspects of diffusion in thin films

2. Atomic model for grain boundary and surface diffusion

3. Cahn , R. W. 1974.Physical MetallurgyEdited by: Cahn , R. W. 1129Amsterdam: North-Holland.

4. Studies on Compound Thin Film Semiconductors by Ion Beam and Electron Microscopy Techniques

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Practical Ohmic Contacts to Silicon;VLSI Electronics Microstructure Science;1986

2. Low temperature compound formation in thin film couples;Thin Solid Films;1982-08

3. Influence of the grain-boundary structure on the rate of mixing in thin polycrystalline films;Physica Status Solidi (a);1980-08-16

4. Kirkendall void formation in thin‐film diffusion couples;Applied Physics Letters;1980-07

5. Diffusion barriers in thin films;Thin Solid Films;1978-08

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