Modeling of a three-dimensional dynamic thermal field under grid-based sensor networks in grain storage
Author:
Affiliation:
1. Department of Industrial Engineering and Management, Peking University, Beijing, P.R. China;
2. Department of Industrial and Systems Engineering, University of Wisconsin-Madison, Madison, WI, USA
Funder
National Natural Science Foundation of China
Special Fund for Agro-scientific Research in the Public Interest
Publisher
Informa UK Limited
Subject
Industrial and Manufacturing Engineering
Link
https://www.tandfonline.com/doi/pdf/10.1080/24725854.2018.1504356
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