Emerging interconnects: a state-of-the-art review and emerging solutions-Reference-Cited by-同舟云学术

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Emerging interconnects: a state-of-the-art review and emerging solutions

Published:2017-03 Issue:7 Volume:104 Page:1107-1119
ISSN:0020-7217
Container-title:International Journal of Electronics
language:en
Short-container-title:International Journal of Electronics

Author:

Turkane S. M.¹²,Kureshi A. K.³

Affiliation:

1. Matoshri College of Engineering & Research Centre, Nashik, Savitribai Phule Pune University, Maharashtra, India

2. Pravara Rural Engineering College, Ahmednagar, Savitribai Phule Pune University, Maharashtra, 413 736, India

3. Vishwabharti Academy’s College of Engineering, Ahmednagar, Savitribai Phule Pune University, Maharashtra, 414201, India

Publisher

Informa UK Limited

Subject

Electrical and Electronic Engineering

Link

https://www.tandfonline.com/doi/pdf/10.1080/00207217.2017.1285436

Reference44 articles.

1. Chen, G., Chen, H., Haurylau, M., Nelson, N. A., Fauchet, P. M., Friedman, E. G. & Albonesi, D. H. (2007a). Predictions of CMOS compatible on-chip optical interconnect. Integration, the VLSI Journal, 40(4),434–446. doi: 10.1016/j.vlsi.2006.10.001

2. Graphene nano-ribbon electronics

3. Signal Transmission Analysis of Multilayer Graphene Nano-Ribbon (MLGNR) Interconnects

4. Mechanical properties of suspended graphene sheets

5. Aluminium alloy as an interconnecting material in the fabrication of integrated circuits

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3. Low-Power Bus Encoding by Ternary LWC and Quaternary Transition Signaling: From Initial Concept to Circuit Design;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2023

4. Investigation on Bandwidth Enhancement in Copper—Carbon Nanotube Composite Interconnects;2022 IEEE 5th International Conference on Automation, Electronics and Electrical Engineering (AUTEEE);2022-11-18

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