Micro-mechanical measurements of fracture toughness of bismuth embrittled copper grain boundaries
Author:
Publisher
Informa UK Limited
Subject
Condensed Matter Physics
Link
http://www.tandfonline.com/doi/pdf/10.1080/09500839.2011.573813
Reference21 articles.
1. Grain boundary fracture in tungsten bi-crystals
2. Fatigue crack growth and fracture behavior of bismuth-doped copper bicrystals
3. Measuring anisotropy in Young’s modulus of copper using microcantilever testing
4. Investigation of elastic properties of single-crystal α-Ti using microcantilever beams
5. Mechanical properties of micro-sized copper bending beams machined by the focused ion beam technique
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