Differential Scanning Calorimetry of Phenol-Formaldehyde (PF) Adhesives-Reference-Cited by-同舟云学术

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Differential Scanning Calorimetry of Phenol-Formaldehyde (PF) Adhesives

Published:1999-08 Issue:3 Volume:19 Page:265-286
ISSN:0277-3813
Container-title:Journal of Wood Chemistry and Technology
language:en
Short-container-title:Journal of Wood Chemistry and Technology

Author:

Park Byung-Dae,Riedl Bernard,Bae Hyeun-Jong,Kim Yoon Soo

Publisher

Informa UK Limited

Subject

General Materials Science,General Chemical Engineering,General Chemistry

Link

http://www.tandfonline.com/doi/pdf/10.1080/02773819909349612

Reference23 articles.

1. Pizzi, A. 1983.Wood Adhesives: Chemistry and Technology, 105–176. New York: Marcel Dekker.

2. Curing of resole-type phenol–formaldehyde resin

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2. Modified phenol formaldehyde resin with sodium silicate as a low-cure wood adhesive;Journal of Wood Chemistry and Technology;2024-02-21

3. Effect of Phenolation, Lignin-Type and Degree of Substitution on the Properties of Lignin-Modified Phenol-Formaldehyde Impregnation Resins: Molecular Weight Distribution, Wetting Behavior, Rheological Properties and Thermal Curing Profiles;Journal of Renewable Materials;2020

4. Comparative curing kinetics study of high char yield formaldehyde- and terephthalaldehyde-phenolic thermosets;Thermochimica Acta;2018-09

5. Eco-Friendly Phenol–Urea–Formaldehyde Co-condensed Resin Adhesives Accelerated by Resorcinol for Plywood Manufacturing;ACS Omega;2018-08-01

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