Peridynamic simulation of transient heat conduction problems in functionally gradient materials with cracks
Author:
Affiliation:
1. Department of Engineering Structure and Mechanics, Wuhan University of Technology, Wuhan, Hubei, China
Publisher
Informa UK Limited
Subject
Condensed Matter Physics,General Materials Science
Link
https://www.tandfonline.com/doi/pdf/10.1080/01495739.2017.1358070
Reference10 articles.
1. Transient heat conduction analysis of functionally graded materials by a multiple reciprocity boundary face method
2. Analytic solutions of multiple moving cracks in an orthotropic layer bonded to an orthotropic FGM coating
3. Computational simulations of thermal shock cracking by the virtual crack closure technique in a functionally graded plate
4. Thermal shock resistance of functionally graded materials
5. Crack propagation in functionally graded strip under thermal shock
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