Mathematical modeling and study of thermoelastic behavior of a bimetallic layer with plane-parallel boundaries under the action of electromagnetic pulses

Author:

Musii R. S.12ORCID,Melnyk N. B.3ORCID,Dmytruk V. A.45ORCID

Affiliation:

1. Department of Higher Mathematics, Lviv Polytechnic National University, Lviv, Ukraine

2. Department of Theory of Physico-Mechanical Fields, Pidstryhach Institute for Applied Problems of Mechanics and Mathematics (IAPMM), National Academy of Sciences of Ukraine, Lviv, Ukraine

3. Department of Software, Lviv Polytechnic National University, Ukraine

4. Department of Applied Mathematics, Lviv Polytechnic National University, Ukraine

5. Department of Non-Classical Problems of Mechanics and Heat-Mass Transfer, Centre of Mathematical Modeling of Pidstryhach Institute for Applied Problems of Mechanics and Mathematics (IAPMM), National Academy of Sciences of Ukraine, Lviv, Ukraine

Publisher

Informa UK Limited

Subject

Condensed Matter Physics,General Materials Science

Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Nonlinear free vibration analysis of the rectangular conductive elastic plate in magnetic field based on homotopy perturbation method;ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik;2024-08-31

2. Computational Aspects of the Use of Different Types of Near-boundary elements in Modeling the Non-stationary Heat Conduction Process;2023 IEEE 18th International Conference on Computer Science and Information Technologies (CSIT);2023-10-19

3. Mathematical modeling and analysis of the thermomechanical behavior of a bimetallic spherical element during technological processing with an electromagnetic impulse;PHYSICO-MATHEMATICAL MODELLING AND INFORMATIONAL TECHNOLOGIES;2022-12-28

4. Study of Thermomechanical Behavior of Electrically Conductive Tubular Elements During Magnetic Impulse Processing;2022 IEEE XVIII International Conference on the Perspective Technologies and Methods in MEMS Design (MEMSTECH);2022-09-07

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