Thermal conductivity and interfacial thermal conductivity of complex boron nitride nanoribbons-Reference-Cited by-同舟云学术

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Thermal conductivity and interfacial thermal conductivity of complex boron nitride nanoribbons

Published:2023-02-01 Issue:3 Volume:46 Page:198-206
ISSN:0149-5739
Container-title:Journal of Thermal Stresses
language:en
Short-container-title:Journal of Thermal Stresses

Author:

Gong Lijuan¹,Shi Hanli¹,He Shuyi¹,Yang Jie²,Han Qingzhen³,Ren Yuehong¹,Zhao Yuehong⁴⁵,Jiang Zhaotan¹^ORCID

Affiliation:

1. School of Physics, Beijing Institute of Technology, Beijing, China

2. Shandong Graphenjoy Advanced Material Co. Ltd, Dezhou, China

3. Beijing Academy of Quantum Information Sciences, Beijing, China

4. University of Chinese Academy of Sciences, Beijing, China

5. National Basic Science Data Center, Beijing, China

Funder

National Natural Science Foundation of China

Blue Fire Plan” (Dezhou) of cooperative Industry-University Innovation of Education Ministry of China

Publisher

Informa UK Limited

Subject

Condensed Matter Physics,General Materials Science

Link

https://www.tandfonline.com/doi/pdf/10.1080/01495739.2023.2166885

Reference35 articles.

1. The rise of graphene

2. Spintronic phase transition of graphene/BN/graphene van de Waals heterostructures

3. ALD-Assisted Graphene Functionalization for Advanced Applications

4. Dynamic response of graphene to thermal impulse

5. Optimized Tersoff and Brenner empirical potential parameters for lattice dynamics and phonon thermal transport in carbon nanotubes and graphene

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Size dependence of melting process of armchair hexagonal boron nitride nanoribbon;Communications in Physics;2024-06-11

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