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Sintering behavior and effect of silver nanoparticles on the resistivity of electrically conductive adhesives composed of silver flakes

  • Published:2014-10-10 Issue:24 Volume:28 Page:2402-2415
  • ISSN:0169-4243
  • Container-title:Journal of Adhesion Science and Technology
  • language:en
  • Short-container-title:Journal of Adhesion Science and Technology

Author:

Xiong Nana,Wang Meina,Zhang Hanping,Xie Hui,Zhao Yuzhen,Wang Yuehui,Li Jingze

Publisher

Informa UK Limited

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry

Cited by 12 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electroless plating silver nanoparticles mixed in oxidized microcrystalline cellulose for microwave absorption applications;Cellulose;2023-05-10

2. Temperature Dependence of the Resistance of Adhesive Conductive Joins and Thermal Expansion of Conductive Adhesives;2023 46th International Spring Seminar on Electronics Technology (ISSE);2023-05-10

3. Effect of Temperature Shocks on the Resistance of Joints Formed of Conductive Adhesives;2023 46th International Spring Seminar on Electronics Technology (ISSE);2023-05-10

4. Preparation of silver nanoparticles and application in water-based conductive inks;International Journal of Modern Physics B;2019-12-30

5. Study of Modification of Conductive Adhesive by Nanoparticles and Aging of Modified Adhesive;2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME);2019-10
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